Global Cold Plate & Manifold Market Valued at $1.5 billion in 2025, Set to Grow at a 10.2% CAGR

Cold plate & manifold market was valued at $1.5 billion in 2025 and is projected to reach $3.9 billion by 2035, growing at a CAGR of 10.2% during the forecast Period (2026-2035). The rising demand for high-performance computing and AI is leading to increased heat from CPUs and GPUs, requiring advanced liquid-cooling solutions like cold plates and manifolds to sustain performance and prevent thermal throttling, which drives market growth. For instance, in September 2025, Boyd delivered 5 million liquid cold plates to hyperscaler clients, enhancing the cooling of AI processors like GPUs and CPUs through efficient global manufacturing. These cold plates connect to manifolds with quick disconnects, creating a custom liquid cooling loop for optimal performance. Boyd prioritizes quality and durability, ensuring reliable efficiency and a complex internal surface area for maximum cooling capacity, supported by an aluminum mounting frame for structural integrity and heat transfer efficiency.

Browse the full report description of “Cold Plate and Manifold Market Size, Share & Trends Analysis by Product Type (Cold Plates, and Manifold), By Material (Aluminum, Copper, Stainless Steel, and Others), and By Application (Data Centers & High Performance Computing (HPC), Electric Vehicles (EVs), Aerospace & Defense, Medical Equipment, Renewable Energy & Industrial, Aerospace & Defense, and Others), Forecast Period (2026-2035)” at https://www.omrglobal.com/industry-reports/cold-plate-and-manifold-market

Investments Driving Advanced Liquid Cooling Technologies

• In November 2025, Eaton Corp. acquired Boyd Corp.'s thermal management business for about $9.5 billion to strengthen its data-center cooling and liquid-cooling capabilities. The acquisition significantly expands Eaton’s portfolio of cold plates, manifolds, and thermal solutions used in hyperscale data centers and AI computing infrastructure.
• In September 2025, Swiss startup Corintis raised $24 million in Series A funding to develop microfluidic chip-level cooling systems. The company focuses on ultra-efficient cooling plates that can improve heat removal for next-generation AI processors and semiconductors.

Market Coverage

• The market number available for – 2025-2035
• Base year- 2025
• Forecast period- 2026-2035
• Segment Covered-
  • By Product Type
  • By Material
  • By Application
• Regions Covered-
  • North America
  • Europe
  • Asia-Pacific
  • Rest of the World
• Competitive Landscape - Asetek A/S, Boyd Corp., CoolIT Systems, Schneider Electric, Vertiv Group Corp., among others

Key questions addressed by the report.

• What is the market growth rate?
• Which segment and region dominate the market in the base year?
• Which segment and region will project the fastest growth in the market?
• Who is the leader in the market?
• How are players addressing challenges to sustain growth?
• Where is the investment opportunity?

Global Cold Plate & Manifold Market Report Segment

By Product Type

• Cold Plates
• Tube-Based Cold Plates
• Channel-Based (Machined) Cold Plates
• Microchannel Cold Plates
• Friction Stir Welded (FSW) Cold Plates
• Vacuum Brazed Cold Plates
• 3D-Printed (Additive Manufactured) Cold Plates
• Manifold
• Rack-Level Manifolds
• In-Row Manifolds
• Vertical/Horizontal Manifolds

By Material

• Aluminum
• Copper
• Stainless Steel
• Others

By Application

• Data Centers & High?Performance Computing (HPC)
• Electric Vehicles (EVs)
• Aerospace & Defense
• Medical Equipment
• Renewable Energy & Industrial
• Aerospace & Defense
• Others(Telecommunications)

Global Cold Plate & Manifold Market Report Segment by Region

North America

• United States
• Canada

Europe

• UK
• Germany
• Italy
• Spain
• France
• Russia
• Rest of Europe

Asia-Pacific

• China
• India
• Japan
• South Korea
• Australia and New Zealand
• ASEAN Economies
• Rest of Asia-Pacific

Rest of the World

• Latin America
• Middle East & Africa

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