The global electrostatic discharge packaging market is anticipated to grow at a significant CAGR of 8.31% during the forecast period. Numerous strategic decision such as partnership and new launch by market players which includes Formlabs, DUO PLAST AG, and Markforged will further boost the growth of the market in the coming year.
Browse the full report description of “Electrostatic Discharge Packaging Market Size, Share & Trends Analysis Report, By Product Type (Bags, Trays, Clamshell, Shrink Films, Boxes & Containers, and Tapes & Labels), By Application (Electrical & Electronic Components and Equipment), By Material & Additive Type (Conductive & Dissipative Polymers, Metal, and Additive), Forecast 2022-2028” at https://www.omrglobal.com/industry-reports/electrostatic-discharge-packaging-market
• In March 2019, Transcendia acquired Purestat Engineered Technologies. This acquisition expands Transcendia’s growing active packaging and barrier film platforms through the addition of anti-static ESD (Electrostatic Dissipative) formulations and multi-layer extrusion and lamination capabilities. Moreover, the product portfolio of Transcendia has increased with the addition of multi-layer barrier bags, films, and laminates to serve high-value market applications in electronics, energy, aerospace, medical, and food.
• In January 2022, Formlabs unveiled ESD Resin, a material designed for manufacturers to reduce risk and increase the yield on electronics manufacturing lines. ESD Resin is a cost-effective solution for producing static-dissipative parts designed for use on the factory floor. The toughness of ESD Resin is higher than that of many other 3D printed ESD-safe materials, engineers can prototype without risk of mechanical or electrical failure.
• In March 2022, DUO PLAST AG launched the innovative film DUO EX-TRA dissipative polymer based on thermoplastic polyurethane (TPU), from BASF polyurethanes in Lemfoerde, Germany, equipped with the static dissipative polymer. Elastostat is particularly suitable for companies in the chemical industry and their suppliers and supplied directly to hazardous areas in the future.
• In December 2020, Markforged announced the launch of Onyx ESD, a new high-strength composite material for the electronics manufacturing industry. The release of Onyx ESD comes amid growing demand for 3D printing materials that are not only safe for electronics manufacturing, however, also produce high-quality and high-strength parts. Onyx ESD was developed to achieve an extremely tight surface resistance range to consistently meet strict ESD-safe requirements. When printing with Onyx ESD, electronics manufacturers can safely produce strong, accurate tools and fixtures ready for the manufacturing floor, as well as high-quality customer-ready parts.
Market Coverage
• The market number available for – 2021-2028
• Base year- 2021
• Forecast period- 2022-2028
• Segment Covered-
o By Product Type
o By Application
o By Material & Additive Type
• Regions Covered- North America, Europe, Asia-Pacific, Rest of the World
• Competitive Landscape- BASF SE, Desco Industries, DuPont de Nemours, Inc., and TIP Corp., among others.
Key questions addressed by the report
• What is the market growth rate?
• Which segment/region dominates the market in the base year?
• Which segment/region will project the fastest growth in the market?
• How has COVID-19 impacted the market?
o Recovery Timeline
o Deviation from the pre-COVID forecast
o Most affected region/segment
• Who is the leader in the market?
• How players are addressing challenges to sustain growth?
• Where is the investment opportunity?
Global Electrostatic Discharge Packaging Market Report by Segment
By Product Type
By Application
By Material & Additive
Global Electrostatic Discharge Packaging Market Report by Region
North America
• US
• Canada
Europe
• Germany
• United Kingdom
• France
• Spain
• Italy
• Rest of Europe
Asia-Pacific
• China
• Japan
• India
• Rest of Asia-Pacific
Rest of the World
• Middle East & Africa
• Latin America
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