The global molded interconnect device market is anticipated to grow at a considerable CAGR of 13% during the forecast period (2022-2028). The rise in adoption of molded interconnect technology across telecommunication equipment will propel the market growth. Several base station equipment used in telecommunication, such as routers, antenna systems, security shields, modules, telecom boxes and terminals are being designed by using molded interconnect technology. It combines the electrical and mechanical functions into single product and further improves the efficiency and reliability of telecommunication system. The telecommunication sector is evolving and expanding globally. The proliferation of 5G base stations in developed as well in developing countries, such as the US, France, China and Germany will accelerate the market growth.
Browse the full report description of “Global Molded Interconnect Device Market Size, Share & Trends Analysis Report by Process (Laser Direct Structuring, Two – Shot Molding and Film Technique) By Product Type (Antennae and Connectivity Modules, Connector and Switches, Sensors, and Lighting) By Industry (Medical, Automotive, Consumer Electronics, Telecommunication, Aerospace and Defence ) Forecast Period (2022-2028)” at https://www.omrglobal.com/industry-reports/molded-interconnect-device-market
For instance, In July 2021, Vice minister of the ministry of industrial and information technology (MIIT) at China internet conference, announced that the China has deployed 916,000 5G base stations and number of 5G connected appliances & devices has crossed 365 million. A plan has been set up to expand the number of users to more than 560 million by 2023 along with 5G penetration rate exceeding 40%. Additionally, in December 2021, a credit rating agency – ICRA has revised its outlook on telecom sector. ICRA has estimated the operating profit of telecommunication industry to grow by approximately 30% in Financial Year 2023.
Market Coverage
• The market number available for – 2021-2028
• Base year- 2021
• Forecast period- 2022-2028
• Segment Covered-
o By Process
o By Product Type
o By Industry
• Regions Covered-
o North America
o Europe
o Asia-Pacific
o Rest of the World
• Competitive Landscape- HARTING Technology Group, DuPont de Nemours, Inc., Ensinger India Engineering Plastics Pvt. Ltd., JOHNAN Corp., TE Connectivity Corp., Evonik Industries AG, LPKF Laser & Electronics AG, Molex LLC and others.
Key questions addressed by the report
• What is the market growth rate?
• Which segment and region dominate the market in the base year?
• Which segment and region will project the fastest growth in the market?
• How COVID-19 impacted the market?
o Deviation from the pre-COVID-19 forecast
o Most affected region and segment
• Who is the leader in the market?
• How players are addressing challenges to sustain growth?
• Where is the investment opportunity?
Global Molded Interconnect Device Market Report By Segment
By Process
By Product Type
By Industry
Global Molded Interconnect Device Market Report By Region
North America
• US
• Canada
Europe
• UK
• Germany
• Italy
• Spain
• France
• Rest of Europe
Asia-Pacific
• China
• India
• Japan
• South Korea
• Rest of Asia-Pacific
Rest of the World
• Latin America
• Middle East & Africa
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