The global molded interconnect device (MID) market is experiencing significant growth, driven by advancements in technology and increasing demand across various industries. MID is a versatile solution that combines mechanical and electrical functionalities, offering compact and cost-effective designs for a range of applications.
The market is segmented based on the process used, including laser direct structuring (LDS), two-shot molding, and film technique. LDS enables the integration of circuitry directly into the plastic component, while two-shot molding combines multiple materials in a single molding process. The film technique involves the use of conductive ink or metalized films for circuit patterning.
In terms of product type, the market includes antennae and connectivity modules, connector and switches, sensors, and lighting. These products find applications in diverse industries such as medical, automotive, consumer electronics, telecommunications, aerospace, and defense. The medical industry benefits from MIDs in devices like medical implants and diagnostic equipment, while the automotive sector utilizes MIDs for smart lighting systems and driver assistance features.
The molded interconnect device market has significant contributors such as Element Solutions Inc., HARTING Technology Group, LPKF Laser & Electronics AG, and Molex LLC, among others. These players assist in the market’s growth with the launch of new products and through collaborations and investments.
Key Drivers of the Molded Interconnect Device Market
Miniaturization and Space-saving Solutions
MIDs offer compact and integrated designs, enabling manufacturers to create smaller and more lightweight electronic components. This is particularly beneficial in industries such as consumer electronics, where devices like smartphones and wearable gadgets require space-efficient solutions. For instance, MIDs allow for the integration of circuitry directly into the plastic housing of a smartphone, eliminating the need for additional components and reducing overall size. Hence, the growth of consumer electronics industry will also boost the demand for MIDs.
Cost-effectiveness and Simplified Assembly
MIDs streamline the manufacturing process by combining mechanical and electrical functionalities into a single component. This simplifies assembly and reduces the number of individual parts required, resulting in cost savings for manufacturers. For instance, in automotive applications, MIDs can integrate multiple functions like sensors, connectors, and switches into a single molded component, reducing the overall production cost.
Improved Performance and Reliability
The integration of circuitry directly into the plastic substrate enhances signal integrity and reduces the risk of failure due to loose connections or wire harnesses. This improves the overall performance and reliability of electronic devices. In medical applications, MIDs enable the development of reliable and compact devices such as implantable medical devices, and diagnostic equipment, ensuring accurate and efficient healthcare solutions.
Advanced Manufacturing Technologies
3D MIDs) were initially met with high expectations in the 1980s but faced challenges due to complexity and cost. However, advancements in processes such as LDS and materials have led to renewed interest. MIDs offer advantages such as reducing component counts and integrating electrical and mechanical functions. Two-shot molding and hot stamping are common MID processes, but LDS is gaining attention for its simplicity, flexibility, and prototyping capabilities. Material suppliers like Ticona, Lanxess, and BASF have developed specialized grades for LDS. Another innovative process, flex foil film-insert overmolding, offers fully automated MID manufacturing.