OSAT Facilities Development to Spur the Global OSAT Market

Published: Aug 2023

The global Outsourced Semiconductor Assembly and Test Services (OSAT) market is anticipated to grow at a considerable CAGR of 8.4% during the forecast period. Ongoing development of new OSAT facilities is a key factor driving the growth of the global OSAT market. For instance, in November 2022, Advanced Semiconductor Engineering, Inc. announced the construction of a new semiconductor assembly and testing facility in Penang, Malaysia. The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone. The company will be investing USD300 million over a period of 5 years to expand its production floor space, procure advanced equipment, and train and develop more engineering talent. 

Browse the full report description of “OSAT Market Size, Share & Trends Analysis Report by Service (Packaging and Testing), Type of Packaging (Ball Grid Array Packaging, Chip-scale Packaging, Stacked Die Packaging, Multi-chip Packaging, and Quad Flat & Dual-inline Packaging), by Application (Communication, Consumer Electronics, Automotive, Computing & Networking, Industrial) Forecast Period (2023-2030)” at https://www.omrglobal.com/industry-reports/outsourced-semiconductor-assembly-and-test-services-market

Further, in April 2023, Vedanta Group announced its plans to start building its Rs 1.5 lakh crore semiconductor plant in October-December 2023 and begin producing electronic chips by the first half of 2027. The joint venture of Indian conglomerate Vedanta and electronics manufacturing giant Foxconn has finalised the Dholera Special Investment Region near Ahmedabad for setting up their semiconductor and display manufacturing facility. Vedanta will also set up an outsourced semiconductor assembly and test plant that will process the semiconductor wafers, making them usable by automobile and electronics companies.

Market Coverage

The market number available for – 2022-2030

Base year- 2022

Forecast period- 2023-2030

Segment Covered-

o By Packaging Type

o By Service Type

o By Application

Regions Covered-

o North America

o Europe

o Asia-Pacific

o Rest of the World

Competitive Landscape- including Powertech Technology Inc., Amkor Technology Inc., Advanced Semiconductor Engineering Inc., Chipmos Technologies Inc., and King Yuan Electronics Co. Ltd. among others

Key questions addressed by the report

What is the market growth rate?

Which segment and region dominate the market in the base year?

Which segment and region will project the fastest growth in the market?

Who is the leader in the market?

How players are addressing challenges to sustain growth?

Where is the investment opportunity?

Global OSAT Market Report Segment

By Packaging Type

  • Ball Grid Array (BGA) Packaging
  • Chip-scale Packaging (CSP)
  • Stacked Die Packaging
  • Multi-chip Packaging
  • Quad Flat and Dual-inline Packaging

By Service Type

  • Packaging
  • Testing

By Application

  • Communication
  • Consumer Electronics
  • Automotive
  • Computing and Networking
  • Industrial
  • Other Applications

Global OSAT Market Report Segment by Region

North America

United States

Canada

Europe

UK

Germany

Italy

Spain

France

Rest of Europe 

Asia-Pacific

China

India

Japan

South Korea

Rest of Asia-Pacific 

Rest of the World

Latin America 

Middle East & Africa


To learn more about this report request a sample copy @ https://www.omrglobal.com/request-sample/outsourced-semiconductor-assembly-and-test-services-market