Advancements in Wafer Grinding Technology and Strategic Collaborations Drives the Market Growth

Wafer grinder market is projected to reach $1,235 million in 2035, from $710 million in 2024, witnessing a CAGR of 5.9% during the forecast period (2025-2035). The miniaturization of electronics demands higher accuracy for wafer grinding, which boosts companies to further develop advanced technology. For instance, in January (2024), Revasum Inc. collaborated with Asahi Diamond America, which produced silicon carbide wafer grinding with a 7AF-HMG Silicon Carbide grinder designed for the 150 mm and 200 mm wafers. The advanced grinder can efficiently thin and planarize wafers, thereby allowing productive processing.

Browse the full report description of “Wafer Grinder Market Size, Share & Trends Analysis Report by Type (Wafer Surface Grinder, and Wafer Edge Grinder), and by Application (Silicon Wafer, SiC Wafer, Sapphire Wafer, and Compound Semiconductors) Forecast Period (2025-2035)” at https://www.omrglobal.com/industry-reports/wafer-grinder-market

Recent Developments 

• In February 2024, KOYO Machinery joined JTEKT Machinery Americas, the acquisition assimilated precision grinding machines and systems of production into JTEKT Machinery's products, further enlarged customer service and support capacity.

• In January 2023, Akoustis Technologies acquired GDSI, the US premium supplier of semiconductor back-end supply chain services. The acquisition is accretive at a high-margin business supporting over 250 customers. Core competencies include wafer grinding and stealth dicing, which support the package reshoring strategy for the application of the CHIPS Act. It additionally supports the DARPA contract R&D business and national security.

• In October 2023, Revasum, Inc., and SGSS collaborated in the development of a new line of grinding wheels for Silicon Carbide wafers. The partnership combines the semiconductor manufacturing equipment expertise from Revasum with abrasive materials from SGSS to change the face of the semiconductor industry - raising the bar on precision, efficiency, and surface quality in SiC wafer production.

Market Coverage

• The market number available for – 2024-2035

• Base year- 2024

• Forecast period- 2025-2035

• Segment Covered- 

o By Type

o By Application

• Regions Covered-

o North America

o Europe

o Asia-Pacific

o Rest of the World

• Competitive Landscape - DISCO Corp., Ebara Corp., G&N GmbH, Infineon Technologies, Tokyo Electron Ltd. and others.

Key questions addressed by the report.

• What is the market growth rate?
• Which segment and region dominate the market in the base year?
• Which segment and region will project the fastest growth in the market?
• Who is the leader in the market?
• How are players addressing challenges to sustain growth?
• Where is the investment opportunity?

Global Wafer Grinder Market Report Segment

By Type

• Wafer Surface Grinder
• Wafer Edge Grinder

By Application

• Silicon Wafer
• SiC Wafer
• Sapphire Wafer
• Compound Semiconductors

Global Wafer Grinder Market Report Segment by Region

North America

• United States

• Canada 

Europe

• UK

• Germany

• Italy

• Spain

• France

• Russia 

• Rest of Europe 

Asia-Pacific

• China

• India

• Japan

• South Korea

• Australia and New Zealand

• ASEAN Economies

• Rest of Asia-Pacific 

Rest of the World

• Latin America 

• Middle East & Africa

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