Trends and Developments in the Molded Interconnect Device Market

Published: Oct 2022


Molded interconnect devices are a technology made by laser direct structuring, printed electronics, and two-shot molding methods and have two layers in them, front and back. It is used in telecommunication, consumer electronics, automotive, and medical devices such as hearing aids, glucose meters, blood pressure monitors, pulse oximeters, dental decay diagnostic tools, CPAP devices, neurostimulation controllers, MEMS-sensor construction, and others.

This technology is useful in saving space, reducing weight, and using fewer components in small devices. Especially in medical equipment, small devices tend to assist well in patients’ diagnosis, operations, and other activities. Moreover, MID technology is used in smartphones, laptops, notebooks, wearable devices, and car steering wheels, among others.

Recent Developments in the Molded Interconnect Device Market 

The companies that are contributing to the market with their new device launches using molded interconnect devices and mergers include Galtronics, LPKF Laser & Electronics AG, Molex LLC, DuPont de Nemours, Inc., Ensinger India HARTING Technology Group, Evonik Industries AG, JOHNAN Corp., M.I.D Solutions Pty. Ltd., Arlington Plating Company (APC), Engineering Plastics Pvt. Ltd., Element Solutions Inc., MacDermid Enthone, LPKF Laser & Electronics. Some of the recent activities by new and existing companies in the MID market include:

In January 2022, MacDermid Enthone Industrial Solutions, a developer and manufacturer of chemical compounds, acquired HSO Herbert Schmidt, an innovator of chemical compounds for electroplating. With this acquisition, the company aims to provide its customers with new and innovative technologies that include molded interconnect devices’ chemical and electric components as well.

In August 2022, the US Food & Drug Administration (FDA) approved the over-the-counter hearing ads. This means more than 30 million US citizens with hearing issues will be able to purchase hearing aids without doctors’ permission, which will save them more than $1,000 in doctor’s appointments. This will prompt market players such as Starkey, ReSound, and others to invest in new launches of hearing aids and light-weight hearing equipment by using MID technology. This, in turn, will support the growth of the molded interconnect device market in the US region.

In April 2022, SABIC, a chemical manufacturing company, launched a glass fiber-reinforced PPS-based compound named LNP THERMOCOMP OFC08V for 5G dipole antennas and other electrical/electronic devices. This compound features laser direct structuring (LDS), which is a method used to create molded interconnect devices.

In August 2022, Gerresheimer AG and Zollner Elektronik AG entered into a partnership to develop technologically advanced solutions to assist in drug delivery and other medical uses for the hospital industry.

The Future of MID Technology

Molded interconnect devices were developed in the 1980s. However, they started gaining traction after their use cases in small medical devices and smartphones. Moreover, this technology resembles the PCB (printed circuit board) technology. The only difference is that the PCB has 8, 16, or as many as 32 layers in it, while the MID only has two. In addition, this technology comes at a high cost. This restrains its quick success in the market.

However, many technological advancements in the medical and other sectors prompt companies to use MID technology in their products. For instance, a new venture called Inspire emerged in the market recently. This company aims to provide solutions to sleep apnea patients. With these new innovations and uses of MID technology in various industries, the market is set to see tremendous growth with a CAGR of 13% in the forecast period (2022-2028), according to OMR Researchers’ analysis.

Conclusion 

Molded interconnect devices are useful in automobiles, smart devices, medical devices, and other industrial machine uses as well. This device reduces the equipment used in any device and makes it light in weight. This enables companies to design products that are portable and quick to use and have small sizes.