Flash Memory Market and the Competitive Landscape

Flash memory is a long-life and non-volatile storage chip that is widely used in embedded systems. It was developed from EEPROM (electronically erasable programmable read-only memory) and can be electrically erased and reprogrammed easily. The two forms of flash memory that rule the market and technology are NOR and NAND flash. NOR flash enables code execution and quick random access to any location in the memory array. In embedded systems, it is usually utilized as a substitute for specific types of ROM applications and as a replacement for the older EPROM. Compared to NOR flash, NAND storage necessitates a longer initial read access to the memory array. NAND costs less per bit than NOR. It is usually used for data storage such as memory cards, USB flash drives, solid-state drives, and similar products, for general storage and transfer of data. The flash memory market is increasing as the requirements of the industries for data storage are increasing.

Browse the full report description of “Solid State Drive Market Size, Share & Trends Analysis Report by Interface (Serial ATA (SATA), Peripheral Component Interconnect Express (PCIe), and Non-Volatile Memory Express (NVME)), by Form Factor (2.5-inch, 3.5-inch, Next Generation Form Factor 2 (M.2), U.2 Small Form Factor (U.2), U.2/SFF 8639, and FHHL/HHHL), by Technology (NAND Flash Memory, Three Dimensional CrossPoint (3D XPoint) Memory, and Zigzag NAND (Z-NAND) Flash Memory), and by End-User (Consumer Electronics, Data Centers, Enterprise IT, and Automotive) Forecast Period (2023-2030)” at https://www.omrglobal.com/industry-reports/solid-state-drive-market

Key features and recent developments of the flash memory market:

• As the recent boom in artificial intelligence (AI) drives up the demand for memory, semiconductor companies are launching new products in the market. For instance, in August 2023, SK Hynix memory Chipmaker Company pulled ahead with a new generation of its "4D NAND" assembled out of 321 layers of NAND flash. Prototypes of the technology were on display at the Flash Memory Summit (FMS) in Santa Clara, California.

• Development in new technologies, for instance, in October 2023, Frore Systems, a startup that recently announced the availability of the world’s first silicon chip for actively removing heat from the processors in electronic devices. The company rolled out a MEMS-based cooling device called AirJet that can remove heat without fans. Instead, it uses ultrasonic vibrations to blow air through the device and over processors that suffer from thermal constraints. As a result, the AirJet fits in a compact form factor, not unlike an ultra-thin heatsink, but it can remove roughly the same amount of heat as the cooling fans it replaces.

• In the Flash Memory Summit (FMS) 2023, XConn Technologies started sampling the industry’s first switch chip to be compatible with the latest CXL 2.0 standard. The new SoC, code-named Apollo, “sets a new standard” in flexibility and performance, according to the startup, since it supports both CXL 2.0 and PCIe Gen 5 in a single chip. It also saves space by requiring the use of a single chip instead of separate CXL and PCIe silicon. The switch chip, officially called XC50256, is equipped with 32 ports that operate at the same data rate as the PCIe Gen 5 standard—up to 32 GT/s—that can be split into 256 lanes to support up to 2.048 TB/s of bandwidth

Flash memory is widely used for storage and data transfer in consumer devices, enterprise systems, and industrial applications. Some of the key players in the market include Micron, Samsung, Intel, Kioxia, SK Hynix, Infineon, Semiconductor Inc, Cypress Semiconductor Corporation, and Microchip. Used in products such as Cell phones, Digital cameras, Media Players, PCs and Laptops, Solid state drives (SSD), Security Systems, and Others.

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